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Packaging RD Engineer

Company: Intel GmbH
Location: hillsboro
Posted on: May 3, 2021

Job Description:

Job ID: JR0164189 Job Category: Engineering Primary Location: Hillsboro, OR US Other Locations: Job Type: College Grad

Packaging RD Engineer

Job Description

Assembly and Test Technology Development (ATTD), Customer Platform Technology Development (CPTD), a group within Intels packaging team, supports multiple business units product assembly needs as well as the Surface Mount Technology (SMT) manufacturing certification of new CPU, chipset, SoC package and socket technology. The prototype factory in Hillsboro, Oregon, provides SMT circuit board manufacturing, system assembly, and parametric, board, and system level test supporting fully functional products. Beyond assembly, CPTD offers multiple areas of technology development expertise enabling next generation product roadmaps through innovative solutions in circuit board technology, assembly processes, and materials.

In this position, you will be a Packaging RD Engineer in CPTDs Hillsboro, Oregon team.
The CPTD organization specializes in process and materials technology development for Printed Circuit Boards (PCBs) and SMT processes. In this role, you will be responsible to develop PCB technology roadmap by partnering with Business units and the PCB manufacturing industry. In addition, you will develop new technologies to help advance Intels PCB roadmap.

What you will do:
As a Packaging RD Engineer at Intel, you will be responsible for development and validation of new PCB technologies to enable Intels next generation product requirements. Your responsibilities will include development of PCB roadmap, influencing senior management on BGA package and Socket PCB design rules, define manufacturability guidelines based on evaluation of PCB supplier technology and capabilities, PCB material and product qualifications and market intelligence across PCB Fabrication supply chain.

You will also be responsible for:
- Develop and validate new PCB technologies to help advance Intels PCB roadmap
- Influence BGA package and Socket PCB design rules based on deeper understanding of PCB design rules and manufacturing processes in internal and external strategic forums
- Perform electrical design simulations to evaluate and recommend technology solutions that meet signal integrity and power delivery requirements
- Partner with business unit to develop PCB roadmap and help advance future Intel platforms
- Interact with PCB suppliers to deliver market intelligence on capability, capacity, and quality of new and existing suppliers across the PCB supply chain, including PCB fabrication, laminate materials, fabrication process equipment, and fabrication chemicals

The candidate should also exhibit the following behavior traits and/or skills:
- Ability to make technical decisions and provide technical direction
- Written and verbal communication skills
- Team building capability

This is an entry level position and will be compensated accordingly.


Qualifications

You must possess the below requirements to be initially considered for this position.

Preferred qualifications are in addition to the requirements and are considered a plus factor in identifying top candidates.

Knowledge and/or experience listed below would be obtained through a combination of your school work and/or classes and/or research and/or relevant previous job and/or internship experiences

Requirements

  • Candidate must possess a Bachelor's degree (with 2+ years of experience) or Master's degree or PhD degree in Electrical Engineering or Materials Science or Chemical Engineering or a related engineering field.


Preferred qualifications:

6+ months of experience in the following:

  • PCB manufacturing industry with understanding of PCB design rules and manufacturing processes.
  • Printed Circuit Board (PCB) and Surface Mount Technology (SMT) Assembly processes.
  • Impedance modeling of PCBs, Signal Integrity and Power delivery strategies for PCB designs.
  • Simulation tools like HFSS, ADS or equivalent is desirable.
  • High frequency electrical measurements - TDR, VNA a plus.
Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moores Law to bring smart, connected devices to every person on Earth



Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Keywords: Intel GmbH, Hillsboro , Packaging RD Engineer, Other , hillsboro, Oregon

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