Job ID: JR0164189 Job Category: Engineering
Primary Location: Hillsboro, OR US Other Locations: Job Type:
Packaging RD Engineer
Assembly and Test Technology Development (ATTD), Customer
Platform Technology Development (CPTD), a group within Intels
packaging team, supports multiple business units product assembly
needs as well as the Surface Mount Technology (SMT) manufacturing
certification of new CPU, chipset, SoC package and socket
technology. The prototype factory in Hillsboro, Oregon, provides
SMT circuit board manufacturing, system assembly, and parametric,
board, and system level test supporting fully functional products.
Beyond assembly, CPTD offers multiple areas of technology
development expertise enabling next generation product roadmaps
through innovative solutions in circuit board technology, assembly
processes, and materials.
In this position, you will be a Packaging RD Engineer in CPTDs
Hillsboro, Oregon team.
The CPTD organization specializes in process and materials
technology development for Printed Circuit Boards (PCBs) and SMT
processes. In this role, you will be responsible to develop PCB
technology roadmap by partnering with Business units and the PCB
manufacturing industry. In addition, you will develop new
technologies to help advance Intels PCB roadmap.
What you will do:
As a Packaging RD Engineer at Intel, you will be responsible for
development and validation of new PCB technologies to enable Intels
next generation product requirements. Your responsibilities will
include development of PCB roadmap, influencing senior management
on BGA package and Socket PCB design rules, define
manufacturability guidelines based on evaluation of PCB supplier
technology and capabilities, PCB material and product
qualifications and market intelligence across PCB Fabrication
You will also be responsible for:
- Develop and validate new PCB technologies to help advance Intels
- Influence BGA package and Socket PCB design rules based on deeper
understanding of PCB design rules and manufacturing processes in
internal and external strategic forums
- Perform electrical design simulations to evaluate and recommend
technology solutions that meet signal integrity and power delivery
- Partner with business unit to develop PCB roadmap and help
advance future Intel platforms
- Interact with PCB suppliers to deliver market intelligence on
capability, capacity, and quality of new and existing suppliers
across the PCB supply chain, including PCB fabrication, laminate
materials, fabrication process equipment, and fabrication
The candidate should also exhibit the following behavior traits
- Ability to make technical decisions and provide technical
- Written and verbal communication skills
- Team building capability
This is an entry level position and will be compensated
You must possess the below requirements to be initially
considered for this position.
Preferred qualifications are in addition to the requirements and
are considered a plus factor in identifying top candidates.
Knowledge and/or experience listed below would be obtained
through a combination of your school work and/or classes and/or
research and/or relevant previous job and/or internship
- Candidate must possess a Bachelor's degree (with 2+ years of
experience) or Master's degree or PhD degree in Electrical
Engineering or Materials Science or Chemical Engineering or a
related engineering field.
6+ months of experience in the following:
Inside this Business Group
- PCB manufacturing industry with understanding of PCB design
rules and manufacturing processes.
- Printed Circuit Board (PCB) and Surface Mount Technology (SMT)
- Impedance modeling of PCBs, Signal Integrity and Power delivery
strategies for PCB designs.
- Simulation tools like HFSS, ADS or equivalent is
- High frequency electrical measurements - TDR, VNA a plus.
As the world's largest chip manufacturer, Intel strives to make
every facet of semiconductor manufacturing state-of-the-art -- from
semiconductor process development and manufacturing, through yield
improvement to packaging, final test and optimization, and world
class Supply Chain and facilities support. Employees in the
Technology and Manufacturing Group are part of a worldwide network
of design, development, manufacturing, and assembly/test
facilities, all focused on utilizing the power of Moores Law to
bring smart, connected devices to every person on Earth
All qualified applicants will receive consideration for employment
without regard to race, color, religion, religious creed, sex,
national origin, ancestry, age, physical or mental disability,
medical condition, genetic information, military and veteran
status, marital status, pregnancy, gender, gender expression,
gender identity, sexual orientation, or any other characteristic
protected by local law, regulation, or ordinance.