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Oregon Die Sort PCM Module Engineer

Company: Intel Corp.
Location: hillsboro
Posted on: May 3, 2021

Job Description:

Oregon Die Sort PCM Module Engineer

Job Description

The Probe Card Metrology (PCM) Module Engineer in ATM (Assembly Test Manufacturing) Oregon Die Sort (ODS) is responsible for supporting factory probe cards (XIUs) and Metrology tools in a 24x7 facility. Your primary responsibility will be to support metrology equipment and provide engineering direction for daily factory sustaining. Additionally, you will be supporting new product introductions for different technologies of XIUs, collaborating with development engineers for potential ECOs and design changes, working with other engineers in the factory to understand and troubleshoot XIU interactions and documenting solutions to errors for training purposes and factory sustaining via spec edits.

You will utilize your time management skills, high level organizational skills, and prioritization skills to maximize Module/XIU availability to world class levels expected of High-Volume Manufacturing (HVM) environments. You will be expected to become proficient in your specific module and understand factory and equipment business processes to effectively manage your XIUs in support of factory goals by supporting daily on-floor activities.

The ideal candidate will exhibit the following behavioral traits:

* Work in a dynamic goal orientated environment with fluid operational priorities.

* High level organizational skills.

* Focused on prioritize competing requests and goals to maximize tool availability.

* Strong interpersonal skills including mentoring, coaching, and technical development of co-workers.

* Clear communication skills

* Willing to take on new and exciting challenges to solve problems of varying difficulty.

This is an entry level position and will be compensated accordingly.


You must possess the below minimum qualifications to be initially considered for this position. Relevant experience can be obtained through school work, classes and project work, internships, military training, and/or work experience.

Position not eligible for Intel immigration sponsorship.

Minimum Qualifications:

* Candidate must possess a Master's or PhD degree in Chemical Engineering , Mechanical Engineering , Electrical/Electronic Engineering, Computer Engineering, Physics, Chemistry, Materials Science or related field. * 2+ years of factory operations experience (e.g. wafer fab or sort floor). * 2+ years of experience with scripting and data analysis skills (or have the prerequisite training or experience to learn Python, JMP/JSL and SQL Pathfinder).

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

USCollege GradJR0156512Hillsboro

Keywords: Intel Corp., Hillsboro , Oregon Die Sort PCM Module Engineer, Other , hillsboro, Oregon

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