LTD Thin Films and CMP Area Senior Principal Engineer
Company: Intel Corporation
Location: Hillsboro
Posted on: September 15, 2023
Job Description:
LTD Thin Films and CMP Area Senior Principal Engineer page is
loaded LTD Thin Films and CMP Area Senior Principal Engineer Apply
locations US, Oregon, Hillsboro time type Full time posted on
Posted 4 Days Ago job requisition id JR0248318 Job Details:Job
Description: - About the Group Technology Development (TD) is the
heart and soul of Moore's Law at Intel. TD has enabled Intel to
create world-changing technology that enriches the lives of every
person on earth. TD's more than 13,000 employees drive breakthrough
research, develop next generation process and packaging
technologies, while also running high volume manufacturing
operations in its state-of-the-art facilities in Oregon and
Arizona. The Logic Technology Development (LTD) team in TD,
delivers programs and modules to ramp new process nodes, supports
HVM and provides a predictable technology cadence for Intel
customers. Intel is in the middle of an exciting transformation,
with a vision to create and extend computing technology to connect
and enrich the lives of every person on Earth. To do this it
requires focused enthusiastic leaders. Join LTD and help create the
next generation of technologies that will touch the lives of people
the world over for decades to come. About the Role Responsibilities
include but are not limited to:
- Technology strategic planning - Envision and articulate
strategic technology plans that will fit across multiple process
generations and integrate into the larger goals of the individual
programs. Negotiate, and proliferate strategic technology plans
across multiple internal and external groups rather than follow
someone else's roadmap.
- Enabling innovations- To deliver program goals with deep
process technology inside from both integrated flow and fundamental
module capabilities.
- Taking initiative - Working in a highly dynamic environment,
with a large number of partners and stakeholders requires the
ability to prioritize critical projects with clear process
technology vision and tenacity to succeed.
- Monitor and drive performance - Equipment performance and
continuous improvement of process modules is required to meet
development commitments and, ultimately, deliver cost-effective
modules to Intel manufacturing organizations.
- Develop Culture - Needs to demonstrate emotional intelligence
to understand how work is completed, how to remove roadblocks, Will
be expected to fully support corporate initiative and to help
leadership in developing a vibrant, diverse, and inclusive cultural
environment where employees and bring their whole selves and
contribute and grow to their maximum potentials.
- Lead External Interactions - Will play a leadership role in
collaborating with equipment and materials suppliers to develop
technology. Lead efforts to establish Intel as the leader for
process technology in its area of responsibility and ensure that
supplier strategic plans are aligned with Intel's needs.
- Partner with Product and Technology Program Managers to deliver
novel process modules to meet needs and with production teams to
achieve output goals.
- Must be willing to occasionally work in a clean room
environment wearing a gown, hood, booties, safety glasses, and
gloves.Required Experience
- 10+ years of experience leading and setting priorities for
multiple engineering teams in a large organization.
- 10+ years of manufacturing process development experience
working with advanced semiconductor technology nodes.
- Experience in working as a module engineer delivering
innovation to enable program goals.
- Significant Experience in leading teams working on interactions
between process modules and programs.
- Significant Experience in collaborating with or working in
major semiconductor suppliers, preferably related to thin films and
CMP.
- Must be able to start within 3 months of receiving an
offer.Qualifications:
- Ph.D. degree in Physics, Material Science, Chemical
Engineering, Electrical Engineering, Mechanical Engineering,
Chemistry, or a closely related field.
- 15+ years of experience in research and/or work in the
semiconductor industry.Job Type:Experienced HireShift:Shift 1
(United States of America)Primary Location: -US, Oregon,
HillsboroAdditional Locations:Business group:As the world's largest
chip manufacturer, Intel strives to make every facet of
semiconductor manufacturing state-of-the-art -- from semiconductor
process development and manufacturing, through yield improvement to
packaging, final test and optimization, and world class Supply
Chain and facilities support. Employees in the -Technology
Development and Manufacturing Group -are part of a worldwide
network of design, development, manufacturing, and assembly/test
facilities, all focused on utilizing the power of Moore's Law to
bring smart, connected devices to every person on Earth.Posting
Statement:All qualified applicants will receive consideration for
employment without regard to race, color, religion, religious
creed, sex, national origin, ancestry, age, physical or mental
disability, medical condition, genetic information, military and
veteran status, marital status, pregnancy, gender, gender
expression, gender identity, sexual orientation, or any other
characteristic protected by local law, regulation, or
ordinance.Position of TrustThis role is a Position of Trust. Should
you accept this position, you must consent to and pass an extended
Background Investigation, which includes (subject to country law),
extended education, SEC sanctions, and additional criminal and
civil checks. For internals, this investigation may or may not be
completed prior to starting the position. For additional questions,
please contact your Recruiter.Work Model for this RoleThis role
will be eligible for our hybrid work model which allows employees
to split their time between working on-site at their assigned Intel
site and off-site. In certain circumstances the work model may
change to accommodate business needs. Similar Jobs (4) LTD
Pathfinding Wet Etch Principal Engineer locations US, Oregon,
Hillsboro time type Full time posted on Posted 30+ Days Ago LTD
Module and Integration Yield Engineer locations US, Oregon,
Hillsboro time type Full time posted on Posted 18 Days Ago About Us
Intel provides reasonable accommodation to applicants and
employees. For more information on our Reasonable Accommodation
process, please click -here . When you use this site, Intel
Corporation uses cookies to improve your online experience. -For
more information, visit our -Cookie Notice .To view our candidate
privacy notice, please click -here .Need to change your email
address?Click on the Cloud icon beside your email address in the
upper right-hand corner and select "Account Settings". Important
Note regarding your email change: -Remember to check the inbox of
the email address you just updated to verify and complete the
change. Verification is required before your account is changed to
reflect the new email address.
Keywords: Intel Corporation, Hillsboro , LTD Thin Films and CMP Area Senior Principal Engineer, Engineering , Hillsboro, Oregon
Didn't find what you're looking for? Search again!
Loading more jobs...