HoP Module Engineer

Company: Intel GmbH
Location: Hillsboro
Posted on: April 5, 2021

Job Description:

Job ID: JR0162274 Job Category: Engineering Primary Location: Hillsboro, OR US Other Locations: Job Type: Experienced Hire HoP Module EngineerJob Description
The module consists of tester(s) and wafer handling equipment and together are used to test and Foveros products. The HoP (HDMT on Prober) Module Engineer will be responsible for ramping, sustaining, and improving several modules, each of which includes a tester rack assembly, a wafer handler, an internal server, and embedded systems software.The Engineer will be expected to meet the safety, quality, and cost-effective output goals for the module. The scope of work includes installation/qualification of equipment, ensuring equipment is matched, and enabling different module configurations to meet products' needs. The HoP Module Engineer is a technical leader capable of influencing and collaborating with our upstream and downstream customers, stakeholders in technology development, and partners in product groups.The ideal candidate should exhibit the following behavioral traits:

• Strong structured problem solving, data analysis, and design of experiments skills.
• Work effectively in a team environment.
• Provide technical mentorship to peers and manufacturing technicians.
• Written and oral communication skills, assertiveness, and influencing skills.
  Qualifications
  
  You must possess the below minimum qualifications to be initially considered for this position.This position is not eligible for Intel immigration sponsorship.Minimum Qualifications:
  • Candidate should have a Bachelor's or Master's in Electrical Engineering, Mechanical Engineering, Computer Engineering, or a Bachelor's or Master's degree in a related field with 2+ years of semiconductor test or manufacturing experience.Inside this Business Group
    As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth
    
    Posting Statement
    
    All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Keywords: Intel GmbH, Hillsboro , HoP Module Engineer, Engineering , Hillsboro, Oregon